Capabilities and Facilities

NODETYPEDESCRIPTIONLOCATION (IF APPLICABLE)
The Australian National UniversityDevice Testing and PackagingBlackbody source for MIR photodetector characterisaionElectronic Materials Engineering
The Australian National UniversityDevice Testing and PackagingLaser diode test bench, inclduing laser diode scriberElectronic Materials Engineering
The Australian National UniversityDevice Testing and PackagingQuantum efficiency measurement systemElectronic Materials Engineering
The Australian National UniversityDevice Testing and PackagingSolar simulatorElectronic Materials Engineering
The Australian National UniversityDevice Testing and PackagingWire bonders and flip chip bonderAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMaterials CharacterisationAtomic force microscope (AFM)Electronic Materials Engineering
The Australian National UniversityMaterials CharacterisationHall effect, deep level transient spectroscopy (DLTS), I-V, C-V, four-point probeElectronic Materials Engineering
The Australian National UniversityMaterials CharacterisationHi-resolution x-ray diffraction (XRD)Electronic Materials Engineering
The Australian National UniversityMaterials CharacterisationPhotoelectrochemical setupElectronic Materials Engineering
The Australian National UniversityMaterials CharacterisationRutherford backscattering spectrometry (RBS) & elastic recoil detection analysis (ERDA)Electronic Materials Engineering
The Australian National UniversityMaterials CharacterisationScanning electron microscope (SEM) with chatodoluminescence (CL)Australian National Fabrication Facility, ACT Node
The Australian National UniversityMaterials CharacterisationScanning electron microscopes (SEM) and transmission electron microscope (TEM)Centre for Advanced Microscopy
The Australian National UniversityMaterials CharacterisationSurface profilometers - opticalLaser Physics Centre
The Australian National UniversityMaterials CharacterisationSurface profilometers - stylusAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMaterials ProcessingLow and high energy ion implanters (several keVs to several MeVs)Electronic Materials Engineering
The Australian National UniversityMaterials ProcessingNanoindentersElectronic Materials Engineering
The Australian National UniversityMaterials ProcessingPrecision ion polishing system (PIPS), ion beam millerElectronic Materials Engineering
The Australian National UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsDC/RF magnetron suptteringAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsDual frequency plasma enhanced chemical vapour deposition (PECVD)Australian National Fabrication Facility, ACT Node
The Australian National UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsMetal Organic Chemical Vapour Deposition for III-As, P, Sb, N materials, including nanowires, quantum dots and hBNAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsPulsed laser deposition for oxide-based materialsElectronic Materials Engineering
The Australian National UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsThermal and plasma-assisted atomic layer depositionAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMicrofabrication and Device TechnologiesBarrel etcherAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMicrofabrication and Device TechnologiesChemical-mechanical polishingAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMicrofabrication and Device TechnologiesElectron Beam evaporatorAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMicrofabrication and Device TechnologiesHot embosserAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMicrofabrication and Device TechnologiesInductively-coupled plasma reactive ion etching (ICP-RIE)Australian National Fabrication Facility, ACT Node
The Australian National UniversityMicrofabrication and Device TechnologiesMask aligners for photolithographyAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMicrofabrication and Device TechnologiesRapid thermal processors, furnacesAustralian National Fabrication Facility, ACT Node
The Australian National UniversityMicrofabrication and Device TechnologiesThermal evaporatorAustralian National Fabrication Facility, ACT Node
The Australian National UniversityNanofabrication: Two-DimensionalDual beam focused ion beam (FIB)Australian National Fabrication Facility, ACT Node
The Australian National UniversityNanofabrication: Two-DimensionalElectron beam lithography (EBL)Australian National Fabrication Facility, ACT Node
The Australian National UniversityNanofabrication: Two-DimensionalGeneral optical microscope with transfer stage for 2D material dry transfer.Research School of Physics
The Australian National UniversityNanofabrication: Two-DimensionalNano-imprint lithography (NIL)Australian National Fabrication Facility, ACT Node
The Australian National UniversityOptical CharacterisationConfocal, SNOM, AFM, Second harmonic microscopeNonlinear Physics Centre
The Australian National UniversityOptical CharacterisationEntangle photon tomography (900-1600 nm)Nonlinear Physics Centre
The Australian National UniversityOptical CharacterisationFour transform infrared spectrometer (FTIR) with IR microscopeElectronic Materials Engineering
The Australian National UniversityOptical CharacterisationFTIR microspectrometer, Hyperion 2000Research School of Physics
The Australian National UniversityOptical CharacterisationMicro polarisation characterisationNonlinear Physics Centre
The Australian National UniversityOptical CharacterisationMicro Transmission / Reflection spectroscopyNonlinear Physics Centre
The Australian National UniversityOptical CharacterisationMicro-Raman, micro-photoluminescenceElectronic Materials Engineering
The Australian National UniversityOptical CharacterisationReflectivity, transmissivity, photoluminescence excitation (PLE)Electronic Materials Engineering
The Australian National UniversityOptical CharacterisationSpectroscopic ellipsometerAustralian National Fabrication Facility, ACT Node
The Australian National UniversityOptical CharacterisationTime-resovled photoluminescence, micro-photoluminescence (low temperature)Electronic Materials Engineering
The Australian National UniversityOptical CharacterisationUltrafast laser system, Chameleon Ultra II with OPO (680-1700 nm)Research School of Physics
The University of MelbourneOptical CharacterisationCustom tabletop spectral characterisation set-up (VIS)School of Physics
The University of MelbourneOptical CharacterisationEQE testing set-up (Energetiq LDLS, monochromator, custom microscope)School of Physics
The University of MelbourneOptical CharacterisationFTIR microspectrometer (Perkin Elmer), Janis cryostat, infrared lasers (2.2, 4.5, 8.35 um)School of Physics
The University of MelbourneOptical CharacterisationOptical custom benchtop microscope (VIS)School of Physics
The University of MelbourneOptical CharacterisationOptical trapping microscopeSchool of Physics
The University of MelbourneOptical CharacterisationProbe station (Evergreen) and source measure units (Keithley)School of Physics
The University of MelbourneOptical CharacterisationSpatial light modulatorSchool of Physics
The University of MelbourneOptical CharacterisationSupercontinuum laserSchool of Physics
The University of MelbourneOptical CharacterisationTunable spectral filter (Bandwidth >5 nm)School of Physics
The University of MelbourneOptical CharacterisationUpright and inverted microscopes including extensive polarisation analysis componentsSchool of Physics
RMIT UniversityDevice Testing and PackagingDirect circuit printersMiniaturised Functional Devices Laboratory
RMIT UniversityDevice Testing and PackagingElectronic and optoelectronic characterisation test stationsMiniaturised Functional Devices Laboratory
RMIT UniversityDevice Testing and PackagingElectronic packaging and interfacingMiniaturised Functional Devices Laboratory
RMIT UniversityDevice Testing and PackagingEnvironmental stages (electrical, thermal, cryogenic, and gaseous environments)Miniaturised Functional Devices Laboratory
RMIT UniversityDevice Testing and PackagingLarge-area screen printerMiniaturised Functional Devices Laboratory
RMIT UniversityDevice Testing and PackagingMicro- and nano-electronic probe stationsMiniaturised Functional Devices Laboratory
RMIT UniversityDevice Testing and PackagingSemiconductor parametric analysersMiniaturised Functional Devices Laboratory
RMIT UniversityMaterials CharacterisationAtomic force microscope (thin film materials, multimodal capabilities)Micro Nano Research Facility
RMIT UniversityMaterials CharacterisationAtomic force microscopes (biomaterials and liquid media)Micro Nano Research Facility
RMIT UniversityMaterials CharacterisationCryostat (continuous flow)Micro Nano Research Facility
RMIT UniversityMaterials CharacterisationFour point probeMicro Nano Research Facility
RMIT UniversityMaterials CharacterisationGas sensing laboratoriesMicro Nano Research Facility
RMIT UniversityMaterials CharacterisationHigh-precision nanoindenterRMIT Microscopy and Microanalysis Facility
RMIT UniversityMaterials CharacterisationLaser Doppler vibrometersMicro Nano Research Facility
RMIT UniversityMaterials CharacterisationPhotoluminescence and micro-Raman spectrometerMicro Nano Research Facility
RMIT UniversityMaterials CharacterisationScanning electron microscopes (SEM)RMIT Microscopy and Microanalysis Facility
RMIT UniversityMaterials CharacterisationSpectroscopic ellipsometerMicro Nano Research Facility
RMIT UniversityMaterials CharacterisationSuper-resolution fluorescence microscopyMicro Nano Research Facility
RMIT UniversityMaterials CharacterisationSurface profilometers: stylus and opticalMicro Nano Research Facility
RMIT UniversityMaterials CharacterisationUltraviolet photoelectron spectroscopy (UPS)RMIT Microscopy and Microanalysis Facility
RMIT UniversityMaterials CharacterisationX-ray diffraction (high-resolution analysis)RMIT X-Ray Facility
RMIT UniversityMaterials CharacterisationX-ray diffraction (rapid analysis)Micro Nano Research Facility
RMIT UniversityMaterials CharacterisationX-ray photoelectron spectroscopy (XPS)RMIT Microscopy and Microanalysis Facility
RMIT UniversityMaterials ProcessingBiomaterials functionalisation and bioplotterMicro Nano Research Facility
RMIT UniversityMaterials ProcessingDeep reactive ion etching (DRIE): Silicon Bosch processMicro Nano Research Facility
RMIT UniversityMaterials ProcessingFocussed ion beam system: GaRMIT Microscopy and Microanalysis Facility
RMIT UniversityMaterials ProcessingGlove boxes for nanomaterials processingMicro Nano Research Facility
RMIT UniversityMaterials ProcessingHigh-temperature annealing furnaces: Contact annealingMicro Nano Research Facility
RMIT UniversityMaterials ProcessingHigh-temperature annealing furnaces: Silicon dopingMicro Nano Research Facility
RMIT UniversityMaterials ProcessingHigh-temperature annealing furnaces: Silicon oxidationMicro Nano Research Facility
RMIT UniversityMaterials ProcessingHigh-temperature annealing furnaces: Titanium in-diffusion in lithium niobateMicro Nano Research Facility
RMIT UniversityMaterials ProcessingInductively-coupled plasma deep reactive ion etching (ICP-RIE)Micro Nano Research Facility
RMIT UniversityMaterials ProcessingLaser machining systemMicro Nano Research Facility
RMIT UniversityMaterials ProcessingPhysical containment Level 2 (PC2) facility for bacterial cell handlingSir Ian Potter NanoBioSensing Facility
RMIT UniversityMaterials ProcessingPhysical containment Level 2 (PC2) facility for mammalian cell handlingMicro Nano Research Facility
RMIT UniversityMaterials ProcessingVacuum and low pressure annealing furnacesMicro Nano Research Facility
RMIT UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsLow pressure chemical vapour deposition (LPCVD)Micro Nano Research Facility
RMIT UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsMagnetron sputtering systems (DC, pulsed DC, and RF)Micro Nano Research Facility
RMIT UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsPlasma-enhanced atomic layer deposition (ALD)Micro Nano Research Facility
RMIT UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsPlasma-enhanced chemical vapour deposition (PECVD)Micro Nano Research Facility
RMIT UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsSilanisationMicro Nano Research Facility
RMIT UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsThermal evaporatorMicro Nano Research Facility
RMIT UniversityMaterials Synthesis: Thin Films and Two-Dimensional MaterialsVapour deposition systems (chemical and physio-chemical)Micro Nano Research Facility
RMIT UniversityMicrofabrication and Device TechnologiesCyclic olefin copolymer (COC) processingMicro Nano Research Facility
RMIT UniversityMicrofabrication and Device TechnologiesMicrofluidic device fabricationMicro Nano Research Facility
RMIT UniversityMicrofabrication and Device TechnologiesPhotolithography: Mask aligners with backside alignment and nanoimprint lithographyMicro Nano Research Facility
RMIT UniversityMicrofabrication and Device TechnologiesPhotolithography: Maskless aligner (MLA)Micro Nano Research Facility
RMIT UniversityMicrofabrication and Device TechnologiesPhotolithography: Training and demonstration stationsMicro Nano Teaching Facility
RMIT UniversityMicrofabrication and Device TechnologiesPolydimethyl siloxane (PDMS) processingMicro Nano Research Facility
RMIT UniversityMicrofabrication and Device TechnologiesWafer bonderMicro Nano Research Facility
RMIT UniversityMicrofabrication and Device TechnologiesWet chemical processing for etching, surface treatment, and electroplatingMicro Nano Research Facility
RMIT UniversityNanofabrication: Three-DimensionalFocussed ion beam system: He, Ne, and GaMicro Nano Research Facility
RMIT UniversityNanofabrication: Three-DimensionalMetal and polymer 3D printing: additive and subtractiveAdvanced Manufacturing Precinct
RMIT UniversityNanofabrication: Three-DimensionalNanoscale additive manufacturing systemLaboratory of Artificial Intelligence Nanophotonics
RMIT UniversityNanofabrication: Three-DimensionalNanoscale subtractive manufacturing systemLaboratory of Artificial Intelligence Nanophotonics
RMIT UniversityNanofabrication: Three-DimensionalNanoscribe 3D printerMicro Nano Research Facility
RMIT UniversityNanofabrication: Three-DimensionalTransmission electron microscopes (TEM)RMIT Microscopy and Microanalysis Facility
RMIT UniversityNanofabrication: Two-DimensionalElectron beam lithography (EBL)Micro Nano Research Facility
RMIT UniversityNanofabrication: Two-DimensionalNano-imprint lithography (NIL)Micro Nano Research Facility
RMIT UniversityOptical CharacterisationMicrophotospectrometerMicro Nano Research Facility
RMIT UniversityOptical CharacterisationNanoscale imaging systemLaboratory of Artificial Intelligence Nanophotonics
RMIT UniversityOptical CharacterisationScanning near-field optical microscope (SNOM)Micro Nano Research Facility
RMIT UniversityOptical CharacterisationTerahertz time domain spectrometerMicro Nano Research Facility
RMIT UniversityStretchable and Wearable DevicesIntegration of miniature wireless electronicsMiniaturised Functional Devices Laboratory
RMIT UniversityStretchable and Wearable DevicesSoft electronics fabricationMicro Nano Research Facility
RMIT UniversityStretchable and Wearable DevicesSoft electronics testing stationMiniaturised Functional Devices Laboratory
University of Technology SydneyElectrical characterisationHall System (LN) FEIT
University of Technology SydneyElectrical characterisationProbe Station (4 probes) + Parametric AnalyserFEIT
University of Technology SydneyMaterials CharacterisationScannig probe microscopyScience
University of Technology SydneyMaterials ProcessingBeam-directed surface functionalizationScience
University of Technology SydneyMaterials ProcessingDirect-write electron & ion beam-induced etchingScience
University of Technology SydneyMaterials ProcessingOptical and electron beam lithographyScience
University of Technology SydneyMaterials ProcessingReactive ion etchingScience
University of Technology SydneyMaterials SynthesisHT Tube FurnaceScience
University of Technology SydneyMaterials SynthesisNanoSputtererFEIT
University of Technology SydneyMaterials Synthesis: NanostructuresDirect-write electron/ion beam-directed growth of nanostructesScience
University of Technology SydneyMaterials Synthesis: NanostructuresGrowth of diamondScience
University of Technology SydneyMaterials Synthesis: Thin Films and Two-Dimensional MaterialsGrowth and wet/dry trasfer of 2D materialsScience
University of Technology SydneyMicrofabrication and Device TechnologiesDevice fabrication from 2D and 3D materialsScience
University of Technology SydneyOptical CharacterisationConfocal photoluminescence spectroscopy (room temperature, high temperature, cryogenic, controlled gaseous environments)Science
University of Technology SydneyOptical CharacterisationConfocal Raman spectroscopyFEIT
University of Technology SydneyOptical CharacterisationODMRScience
University of Technology SydneyOptical CharacterisationPhoton correlation analysis; characterisation of single photon emittersScience
University of Technology SydneyOptical CharacterisationFT IR microscopeFEIT
University of Technology SydneyOptical Characterisationa diffuse reflectance FTIR system with environmental chamber called “Praying Mantis” from ThermoFisher. to study surface-enhanced infrared absorption (SEIRA) for chemical sensing using plasmonics/metasurfaces.FEIT
The University of Western AustraliaAnnealingA cold wall bench top rapid thermal processor, to provide high cooling rates and low memory effect of the process chamber [category : Material modification]Microelectronics Research Group
The University of Western AustraliaCryostat IR array characterisation systemIR transmission/reflection system to characterise spectrometer/filter performance [category : Spectroscopy]Microelectronics Research Group
The University of Western AustraliaDeep-level transient spectroscopyCharacterisation of semiconductor bandgap energy levels using deep-level transient spectroscopy (DLTS) [category : Spectroscopy]Microelectronics Research Group
The University of Western AustraliaElectron Beam Evaporation (E-Beam Evaporation)Ability to deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. The tool allows thick film deposition and also multiple coatings. [category : Deposition]Microelectronics Research Group
The University of Western AustraliaHall effect measurement system2T electromagnet to perform Hall effect measurements [category : Electrical Characterisation]Microelectronics Research Group
The University of Western AustraliaLaser Beam Induced Current (LBIC) Scanning Laser MicroscopyMapping of material quality and device performance using a laser induced current [category : Electrical Characterisation]Microelectronics Research Group
The University of Western AustraliaLaser Doppler VibrometerNon-contact vibration analysis commonly used to characterise MEMS devices [category : Vibrometry]Microelectronics Research Group
The University of Western AustraliaOptical microscopyProvides sub-micron 3D observation/measurement with the ability to compare very rough surface shapes [category : Microscopy]Microelectronics Research Group
The University of Western AustraliaOptical profilometerNon-contact 3D scanning white light and optical phase-shifting interferometer. [category : Profilometry]Microelectronics Research Group
The University of Western AustraliaPlasma Enhanced Chemical Vaoupr Deposition (PECVD)Variable plasma properties providing high density, low ion energy, and low pressure plasma deposition of dielectric films. Low stress plasma chemical vapour deposition of low-stress films to satisfy mechanical requirement of MEMS devices. A large variety of substrates from wafers up to 200 mm diameter to parts loaded on carriers can be processed [category : Deposition]Microelectronics Research Group
The University of Western AustraliaReactive Ion Etching (RIE)System for plasma enhanced chemical vapour deposition system (PECVD) and reactive ion etching (RIE) [category : Etching]Microelectronics Research Group
The University of Western AustraliaRiber 32B Molecular Beam Epitaxy SystemVersatile tool that deposits amounts of material onto substrates. Often used to design and create semiconductor structures for manufacturing many novel devices [category : Deposition]Microelectronics Research Group
The University of Western AustraliaSemi-automatic wafer probe stationProbe station with B&L Microzoon [category : Electrical Characterisation]Microelectronics Research Group
The University of Western AustraliaSemiconductor parameter analyserDigital sweep parameter. Used for failture analysis and automated incoming inspection [category : Electrical Characterisation]Microelectronics Research Group
The University of Western AustraliaSpin coating and wafer developmentSoftbake, post-exposure bake and hardbake processes. [category : Lithography]Microelectronics Research Group
The University of Western AustraliaSputtering using 4Wave The Laboratory Alloy and Nanolayer System (LANS)Provides atomically engineered thin films and inerfaces. The tool can vary process pressures, adatom energies, and provides good uniformity and repeatability [category : Deposition]Microelectronics Research Group
The University of Western AustraliaThermal evaporationThermal evaporator designed for Zinc Sulfide deposition [category : Deposition]Microelectronics Research Group
The University of Western AustraliaThermal evaporationCustom made dual chamber thermal evaporator for deposition of metal and non-metal materials with high deposition rate and high purity [category : Deposition]Microelectronics Research Group
The University of Western AustraliaWafer BondingManual flip chip bonder with high accurace of 0.5 µm [category : Bonding]Microelectronics Research Group
The University of Western AustraliaWedge BonderManual wedge bonder, simple set-up and incorporates analogue controls for ease of use. This allows rapid admustment of individual bonding parameters [category : Bonding]Microelectronics Research Group